Highlights | Schedule | Exhibitor List

This panel will feature software users presenting company "wish lists," features of simulators that are considered necessary or useful, but either are not available today, or not in a fully functional manner. The purpose is to orient software companies to focus on features which are the most important to many of the end users. To support the wish lists, the panel members will submit simple challenges for the software vendors, for which the answer is either obvious (can be found by simple speculation) or repeatable measured data exist, and these challenges, representing the sought-after features, can be handed over to the software vendors after the panel discussion.

Chairperson

Istvan Novak, Senior Signal Integrity Staff Engineer, Sun Microsystems, is engaged in the design and characterization of power-distribution networks and packages for workgroup servers. He creates simulation models, and develops measurement techniques for power distribution. Mr. Novak has more than twenty years of experience with high-speed digital, RF, and analog circuit and system design. He is Fellow of IEEE for his contributions to the signal-integrity and RF measurement and simulation methodologies.

Panelists

Sergio Camerlo, Director, Engineering, Cisco Systems, currently leads an organization strongly focused on technology and its application to products and encompasses packaging design, optics, and power. Packaging design covers signal integrity, layout engineering, ASIC packaging, and technology/modules (MCP, MCM). Several products of recent introduction benefit from the successful application of advanced disciplines and methodologies developed through Mr. Camerlo's organization and leadership.

James Drewniak, Professor, Electrical Engineering, University of Missouri, Rolla, is one of the principle faculty in the Electromagnetic Compatibility Laboratory. His research and teaching interests include electromagnetic compatibility in high-speed digital and mixed signal designs, electronic packaging, and electromagnetic compatibility in power electronic based systems.

Jun Fan, Senior Hardware Engineer, NCR Corporation, is focused on signal integrity and EMI designs in high-speed digital systems, dc power-bus modeling, PCB noise reduction, and differential signaling. Dr. Fan received the Conference Best Paper Award from the Applied Computational Electromagnetics Society in 2000. He serves as secretary of TC-9 Computational Electromagnetics Committee of the IEEE EMC Society.

Ravi Kaw, Chip Package Co-Design and Signal Integrity, ASIC Products Division, Agilent Technologies, has published over 25 papers in the areas of device physics, IC processing, and packaging, and currently holds three patents. His current research interests include modeling, measurement, and design of high performance/ high pin count packages as well as microwave single chip and hybrid packages.

JP Miller, Distinguished Technologist, Industry Standard Servers, Hewlett-Packard, is working on advancing the development technology used in ISS. Mr. Miller has been with Compaq and now HP for 17 years designing desktops and servers from the first Systempro server. He represented Compaq on the InfiniBand specification development.

Alex Waizman, Principal Engineer, iMPG Design Center, Intel, is responsible for the package design, motherboard integration and package and mother board power delivery in developing the Centrino ^TM microprocessor. He has previously worked on a variety of analog-related topics including: Ethernet physical access, delay line and phase locked loops, high-speed testing and high speed IO design.