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Jan De Geest, R&D Engineer, Signal Integrity Group, FCI Electronics
Stefaan Sercu, Manager, Signal Integrity Group, FCI Electronics
Craig Clewell, Senior Signal-Integrity Engineer, FCI Electronics
James Nadolny, Senior Staff Signal-Integrity Engineer, FCI Electronics

S-parameters are well suited to accurately represent the behavior of a passive interconnect over a broad frequency range. The ability to simulate the impact of drivers and receivers on the interconnection link requires the co-simulation of these linear S-parameter models with the non-linear models for the silicon devices. This paper provides an overview of existing techniques to include S-parameter data in SPICE simulations as well as their advantages and disadvantages. It focuses on the generation of accurate broadband SPICE models for connectors, starting from measured or simulated S-parameter data.