DesignCon Home
DesignCon 2006
Register Today
Home Conference Exhibition Exhibitor Info Sponsorship Press


Presented By
Official Sponsor
Diamond Sponsor
Gold Sponsor
Merchandise Sponsors
Hospitality Sponsor
Official Mangement Forum Sponsor
PCB Pavilion Sponsor
Official Public Relations Sponsor
Official Media Sponsor
Official News Service
Media Sponsors
Circuit Cellar
Connector Specifier
Connector Supplier
EDACafe
EG3
PCB007
Portable Design
System Design Frontier


Previous DesignCons: 2004
2004 Archive
Highlights | Schedule | Exhibitor List

10-TA3
Tuesday, February 3 | 11:00 am 11:45 am
A Hybrid Measurement and Electromagnetic Field Solver Approach for the Design of High-Performance Interconnects: An Investigation of Traces and SMA Transitions
Scott McMorrow, President, Teraspeed Consulting Group LLC
Alfred Neves, Applications Engineer, TDA Systems

As the cost of bringing complex high-performance systems to market increases and the time to market decreases, new methods must be used to insure first-pass design success. This paper describes a design method that establishes excellent signal integrity at the lowest reasonable cost and with a verifiable design methodology. By approaching the design with a coordinated approach of field solver and measurement-based modeling methods, the net process is verifiable, and problems with the design can be uncovered and resolved in the shortest time. This process yields incredible time- and frequency-domain performance using off-the-shelf, generic, non-esoteric, non-expensive materials.